AI算力（GB200/300）AI computing power
理解顶级算力，才能提供顶级散热。AI的竞赛，也是散热技术的竞赛，当前正处于从风冷到液冷历史性转换的临界点。GB200/300作为高度集成的系统，其散热需求已从单一的芯片级，扩展到芯片、内存、NVLink互连模块、供电模块等多个高热源的整体协同散热。
Only by understanding top-tier computing power can we deliver top-tier thermal management. The race for AI supremacy is also a race for thermal management technology, and we are currently at a historic turning point in the transition from air cooling to liquid cooling. As highly integrated systems, the GB200/300 series now require thermal management that extends beyond a single chip to encompass the coordinated cooling of multiple high- heat-generating components, including the chip, memory, NVLink interconnect modules and power delivery modules.
